Semiconductor series
Taiwan MJC provides diversified testing solutions
MJC provides diversified solutions to help improve the quality and productivity of semiconductor design and manufacturing, from probe card, tester and wafer prober for semiconductor wafer testing to test sockets for final testing.
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SEMICONDUCTOR PROCESS
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01
Wafer
IC* chips(semicondoctors) are primarily manufactured on ultra-high purity.
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02
Wafer process
A circuit pattern is printed on the wafer and a fine electronic circuit is formed by injecting ions.
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03
Recommended ProductsWafer testing
Semiconductor devices on wafers are tested for electric properties.
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04
Assembly process
The IC chips are cut from the wafer ever, few millimeters and encapsuleted in a package using a resin mold.
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05
Recommended ProductsFinal inspection
The completed IC chip receives a rigorous inspection for performance and reliability using a test socket.
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Wafer Prober
In semiconductor development, wafer probe is mainly used for IC characteristic evaluation, reliability evaluation and defect analysis in wafer manufacturing process. It carries out high-precision measurement and evaluation of test element group (TEG), including process characteristics and electrical verification.
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