Needle Specifications for Small Pads(BC Probe)

The needle specifications adopt a simulated stress design that reduces the scrub amount of the needle tip in order to reduce device pad damage.
  • Can be used for pads of thin-film, low-k, PoP, POAA and CUP devices
  • The needle specifications are designed according to the pad structure and test conditions.
*BC Probe:Bow Contact Probe
  • FPD Products

    FPD Products

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  • Probe Card

    Probe Card

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  • Wafer Prober

    Wafer Prober

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  • Tester

    Tester

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  • Test Socket

    Test Socket

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